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Module example. The photo is from Optoelectronics and SEI.
The structure of the newly developed module. Pictures from Tanaka Precious Metals and SEI.
On April 4, 2016, Japan's Tanaka Precious Metals Industry Corporation and SEI announced the use of low-temperature bonding material “AuRoFUSE†containing gold particles (0.1μm grade) to develop LED modules that meet high output power requirements. Under the influence of the heat generated when the LED lighting is turned on, the output power will decrease, and therefore, there is a problem of how to improve the heat dissipation of the LED module. This new product solved this problem.
The specific method is to perform flip chip bonding using AuRoFUSE as a bonding material instead of the current mainstream method—wire bonding. Flip chip bonding is a method of electrically connecting a chip to a lead frame and a substrate by using protruding terminals (bumps). The LED chip is directly bonded to the substrate, and a light emitting surface as a heat source is close to the substrate, so that heat is easily generated. Distribute. In addition, by removing the leads, not only the space occupied by the leads can be saved, miniaturization can be achieved, but also the electrical characteristics can be improved.
However, in the past, when performing flip-chip bonding, expensive aluminum nitride must be used on the substrate. This is because there is a large difference in the coefficient of thermal expansion between the inexpensive metal substrate and the LED chip, and the joint is easily broken. In this technology, AuRoFUSE, which is a bonding material, contains gold particles, and these gold particles can reduce deformation during thermal expansion. Therefore, an inexpensive metal substrate can be used. With this technology, LED modules can achieve high output power and miniaturization.
Tanaka Precious Metals will exhibit the LED module through its booth at the 3rd Japan High-Performance Metal Show held at Tokyo Ariake International Convention and Exhibition Center on April 6, 2016. The company's future goal is to expand the use of the LED module to import and export refrigeration warehouses and automotive lighting that can take advantage of miniaturization. (Reporter: Mori Mori)
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